Ultrasonic cleaning technology first appeared in the early 1930s, when the United States is located in New Jersey, the United States Radio Corporation in a laboratory of technical personnel to try to use homemade rudimentary ultrasonic cleaning system to clean some objects, but the test was not successful. On this basis, ultrasonic cleaning technology in the 1950s had a great development, when the use of ultrasonic operating frequency between 20 ~ 40 kHz. The range of ultrasound is used in thousands of different work situations, many of which are other cleaning means can not work well in the occasion. Ultrasound can apply a very large amount of energy to the workpiece, especially for removing dirt firmly attached to the substrate. However, in some cases, the powerful energy of ultrasound can also damage the substrate material which is sticky and fragile in nature. Over the past decade or so, a number of technological innovations have emerged in the field of ultrasound that have improved the safety margin for removing contaminants from sensitive substrates. During this period, ultrasonic technology, especially in the high frequency ultrasonic cleaning technology has a new development, and become the highlight of the industry. In recent years, people found that the megasonic (according to the frequency of ultrasound, 40 kHz and below called conventional or low-frequency ultrasound, more than 1 000 kHz called high-frequency ultrasound, also known as megasonic, referred to as megasonic) cleaning can be removed from the surface of the semiconductor material ultra-fine dirt particles, and will not damage the surface of the substrate material. At present, this technology has been popularized very quickly.